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authorStephen Rothwell <sfr@canb.auug.org.au>2014-01-10 10:33:18 +1100
committerStephen Rothwell <sfr@canb.auug.org.au>2014-01-10 10:33:18 +1100
commit46bcf48754452ae3e29f6a1f5296bd9556969bc9 (patch)
tree545b47d9773c893188f51052e67b177bfb9744b4 /Documentation
parent2fdc279b764461883e4552c32d023b0d04d9abb8 (diff)
parent6f9e13f198c7b66049fcb12dc91787a57bf36267 (diff)
Merge remote-tracking branch 'imx-mxs/for-next'
Diffstat (limited to 'Documentation')
-rw-r--r--Documentation/devicetree/bindings/vendor-prefixes.txt3
1 files changed, 3 insertions, 0 deletions
diff --git a/Documentation/devicetree/bindings/vendor-prefixes.txt b/Documentation/devicetree/bindings/vendor-prefixes.txt
index 2652b9e1ccc7..d6ac1b5e88ea 100644
--- a/Documentation/devicetree/bindings/vendor-prefixes.txt
+++ b/Documentation/devicetree/bindings/vendor-prefixes.txt
@@ -26,9 +26,11 @@ cortina Cortina Systems, Inc.
dallas Maxim Integrated Products (formerly Dallas Semiconductor)
davicom DAVICOM Semiconductor, Inc.
denx Denx Software Engineering
+dmo Data Modul AG
emmicro EM Microelectronic
epson Seiko Epson Corp.
est ESTeem Wireless Modems
+eukrea Eukréa Electromatique
fsl Freescale Semiconductor
GEFanuc GE Fanuc Intelligent Platforms Embedded Systems, Inc.
gef GE Fanuc Intelligent Platforms Embedded Systems, Inc.
@@ -79,6 +81,7 @@ toshiba Toshiba Corporation
toumaz Toumaz
v3 V3 Semiconductor
via VIA Technologies, Inc.
+voipac Voipac Technologies s.r.o.
winbond Winbond Electronics corp.
wlf Wolfson Microelectronics
wm Wondermedia Technologies, Inc.