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author | Linus Torvalds <torvalds@linux-foundation.org> | 2021-05-05 12:46:48 -0700 |
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committer | Linus Torvalds <torvalds@linux-foundation.org> | 2021-05-05 12:46:48 -0700 |
commit | 583f2bcf86a322dc0387f5a868026d2e2fe18261 (patch) | |
tree | 9ce028c7f072fc9f2198296cc33b6abe213f537f /MAINTAINERS | |
parent | 5d6a1b84e07607bc282ed2ed8e2f128c73697d5c (diff) | |
parent | c310e546164d5cca4c12faf9582b75989b030b68 (diff) |
Merge tag 'thermal-v5.13-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano:
- Remove duplicate error message for the amlogic driver (Tang Bin)
- Fix spellos in comments for the tegra and sun8i (Bhaskar Chowdhury)
- Add the missing fifth node on the rcar_gen3 sensor (Niklas Söderlund)
- Remove duplicate include in ti-bandgap (Zhang Yunkai)
- Assign error code in the error path in the function
thermal_of_populate_bind_params() (Jia-Ju Bai)
- Fix spelling mistake in a comment 'disabed' -> 'disabled' (Colin Ian
King)
- Use the device name instead of auto-numbering for a better
identification of the cooling device (Daniel Lezcano)
- Improve a bit the division accuracy in the power allocator governor
(Jeson Gao)
- Enable the missing third sensor on msm8976 (Konrad Dybcio)
- Add QCom tsens driver co-maintainer (Thara Gopinath)
- Fix memory leak and use after free errors in the core code (Daniel
Lezcano)
- Add the MDM9607 compatible bindings (Konrad Dybcio)
- Fix trivial spello in the copyright name for Hisilicon (Hao Fang)
- Fix negative index array access when converting the frequency to
power in the energy model (Brian-sy Yang)
- Add support for Gen2 new PMIC support for Qcom SPMI (David Collins)
- Update maintainer file for CPU cooling device section (Lukasz Luba)
- Fix missing put_device on error in the Qcom tsens driver (Guangqing
Zhu)
- Add compatible DT binding for sm8350 (Robert Foss)
- Add support for the MDM9607's tsens driver (Konrad Dybcio)
- Remove duplicate error messages in thermal_mmio and the bcm2835
driver (Ruiqi Gong)
- Add the Thermal Temperature Cooling driver (Zhang Rui)
- Remove duplicate error messages in the Hisilicon sensor driver (Ye
Bin)
- Use the devm_platform_ioremap_resource_byname() function instead of a
couple of corresponding calls (dingsenjie)
- Sort the headers alphabetically in the ti-bandgap driver (Zhen Lei)
- Add missing property in the DT thermal sensor binding (Rafał Miłecki)
- Remove dead code in the ti-bandgap sensor driver (Lin Ruizhe)
- Convert the BRCM DT bindings to the yaml schema (Rafał Miłecki)
- Replace the thermal_notify_framework() call by a call to the
thermal_zone_device_update() function. Remove the function as well as
the corresponding documentation (Thara Gopinath)
- Add support for the ipq8064-tsens sensor along with a set of cleanups
and code preparation (Ansuel Smith)
- Add a lockless __thermal_cdev_update() function to improve the
locking scheme in the core code and governors (Lukasz Luba)
- Fix multiple cooling device notification changes (Lukasz Luba)
- Remove unneeded variable initialization (Colin Ian King)
* tag 'thermal-v5.13-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (55 commits)
thermal/drivers/mtk_thermal: Remove redundant initializations of several variables
thermal/core/power allocator: Use the lockless __thermal_cdev_update() function
thermal/core/fair share: Use the lockless __thermal_cdev_update() function
thermal/core/fair share: Lock the thermal zone while looping over instances
thermal/core/power_allocator: Update once cooling devices when temp is low
thermal/core/power_allocator: Maintain the device statistics from going stale
thermal/core: Create a helper __thermal_cdev_update() without a lock
dt-bindings: thermal: tsens: Document ipq8064 bindings
thermal/drivers/tsens: Add support for ipq8064-tsens
thermal/drivers/tsens: Drop unused define for msm8960
thermal/drivers/tsens: Replace custom 8960 apis with generic apis
thermal/drivers/tsens: Fix bug in sensor enable for msm8960
thermal/drivers/tsens: Use init_common for msm8960
thermal/drivers/tsens: Add VER_0 tsens version
thermal/drivers/tsens: Convert msm8960 to reg_field
thermal/drivers/tsens: Don't hardcode sensor slope
Documentation: driver-api: thermal: Remove thermal_notify_framework from documentation
thermal/core: Remove thermal_notify_framework
iwlwifi: mvm: tt: Replace thermal_notify_framework
dt-bindings: thermal: brcm,ns-thermal: Convert to the json-schema
...
Diffstat (limited to 'MAINTAINERS')
-rw-r--r-- | MAINTAINERS | 3 |
1 files changed, 2 insertions, 1 deletions
diff --git a/MAINTAINERS b/MAINTAINERS index 303340f6b5a0..203a569c0ce4 100644 --- a/MAINTAINERS +++ b/MAINTAINERS @@ -15197,6 +15197,7 @@ F: include/linux/if_rmnet.h QUALCOMM TSENS THERMAL DRIVER M: Amit Kucheria <amitk@kernel.org> +M: Thara Gopinath <thara.gopinath@linaro.org> L: linux-pm@vger.kernel.org L: linux-arm-msm@vger.kernel.org S: Maintained @@ -18101,7 +18102,7 @@ THERMAL/CPU_COOLING M: Amit Daniel Kachhap <amit.kachhap@gmail.com> M: Daniel Lezcano <daniel.lezcano@linaro.org> M: Viresh Kumar <viresh.kumar@linaro.org> -M: Javi Merino <javi.merino@kernel.org> +R: Lukasz Luba <lukasz.luba@arm.com> L: linux-pm@vger.kernel.org S: Supported F: Documentation/driver-api/thermal/cpu-cooling-api.rst |