summaryrefslogtreecommitdiff
path: root/Documentation
diff options
context:
space:
mode:
authorLinus Torvalds <torvalds@linux-foundation.org>2016-05-26 09:23:43 -0700
committerLinus Torvalds <torvalds@linux-foundation.org>2016-05-26 09:23:43 -0700
commitbfb764440d5bee109003295473a0b387bc799222 (patch)
tree23f4683f6aca3b75d81e009f1c8f9b201a6422c1 /Documentation
parent159d08f4b85ce454cd05fb9e2c539276e148d366 (diff)
parent88ac99063e6e38bf9577e75f0d65dd02e2326d58 (diff)
Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui: - Introduce generic ADC thermal driver, based on OF thermal (Laxman Dewangan) - Introduce new thermal driver for Tango chips (Marc Gonzalez) - Rockchip driver support for RK3399, RK3366, and some fixes (Caesar Wang, Elaine Zhang and Shawn Lin) - Add CPU power cooling model to Mediatek thermal driver (Dawei Chien) - Wider usage of dev_thermal_zone_of_sensor_register (Eduardo Valentin) - TI thermal driver gained a new maintainer (Keerthy). - Enabled powerclamp driver by checking CPU feature and package cstate counter instead of CPU whitelist (Jacob Pan) - Various fixes on thermal governor, OF thermal, Tegra, and RCAR * 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (50 commits) thermal: tango: initialize TEMPSI_CFG thermal: rockchip: use the usleep_range instead of udelay thermal: rockchip: add the notes for better reading thermal: rockchip: Support RK3366 SoCs in the thermal driver thermal: rockchip: handle the power sequence for tsadc controller thermal: rockchip: update the tsadc table for rk3399 thermal: rockchip: fixes the code_to_temp for tsadc driver thermal: rockchip: disable thermal->clk in err case thermal: tegra: add Tegra132 specific SOC_THERM driver thermal: fix ptr_ret.cocci warnings thermal: mediatek: Add cpu dynamic power cooling model. thermal: generic-adc: Add ADC based thermal sensor driver thermal: generic-adc: Add DT binding for ADC based thermal sensor thermal: tegra: fix static checker warning thermal: tegra: mark PM functions __maybe_unused thermal: add temperature sensor support for tango SoC thermal: hisilicon: fix IRQ imbalance enabling thermal: hisilicon: support to use any sensor thermal: rcar: Remove binding docs for r8a7794 thermal: tegra: add PM support ...
Diffstat (limited to 'Documentation')
-rw-r--r--Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt12
-rw-r--r--Documentation/devicetree/bindings/thermal/rcar-thermal.txt1
-rw-r--r--Documentation/devicetree/bindings/thermal/tango-thermal.txt17
-rw-r--r--Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt89
-rw-r--r--Documentation/thermal/sysfs-api.txt44
5 files changed, 140 insertions, 23 deletions
diff --git a/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt b/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt
index 6908d3aca598..edebfa0a985e 100644
--- a/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt
+++ b/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt
@@ -26,6 +26,10 @@ Required properties :
of this property. See <dt-bindings/thermal/tegra124-soctherm.h> for a
list of valid values when referring to thermal sensors.
+Note:
+- the "critical" type trip points will be set to SOC_THERM hardware as the
+shut down temperature. Once the temperature of this thermal zone is higher
+than it, the system will be shutdown or reset by hardware.
Example :
@@ -51,5 +55,13 @@ Example: referring to thermal sensors :
thermal-sensors =
<&soctherm TEGRA124_SOCTHERM_SENSOR_CPU>;
+
+ trips {
+ cpu_shutdown_trip: shutdown-trip {
+ temperature = <102500>;
+ hysteresis = <1000>;
+ type = "critical";
+ };
+ };
};
};
diff --git a/Documentation/devicetree/bindings/thermal/rcar-thermal.txt b/Documentation/devicetree/bindings/thermal/rcar-thermal.txt
index e5ee3f159893..a8e52c8ccfcc 100644
--- a/Documentation/devicetree/bindings/thermal/rcar-thermal.txt
+++ b/Documentation/devicetree/bindings/thermal/rcar-thermal.txt
@@ -11,7 +11,6 @@ Required properties:
- "renesas,thermal-r8a7791" (R-Car M2-W)
- "renesas,thermal-r8a7792" (R-Car V2H)
- "renesas,thermal-r8a7793" (R-Car M2-N)
- - "renesas,thermal-r8a7794" (R-Car E2)
- reg : Address range of the thermal registers.
The 1st reg will be recognized as common register
if it has "interrupts".
diff --git a/Documentation/devicetree/bindings/thermal/tango-thermal.txt b/Documentation/devicetree/bindings/thermal/tango-thermal.txt
new file mode 100644
index 000000000000..212198d4b937
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/tango-thermal.txt
@@ -0,0 +1,17 @@
+* Tango Thermal
+
+The SMP8758 SoC includes 3 instances of this temperature sensor
+(in the CPU, video decoder, and PCIe controller).
+
+Required properties:
+- #thermal-sensor-cells: Should be 0 (see thermal.txt)
+- compatible: "sigma,smp8758-thermal"
+- reg: Address range of the thermal registers
+
+Example:
+
+ cpu_temp: thermal@920100 {
+ #thermal-sensor-cells = <0>;
+ compatible = "sigma,smp8758-thermal";
+ reg = <0x920100 12>;
+ };
diff --git a/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt b/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt
new file mode 100644
index 000000000000..d72355502b78
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt
@@ -0,0 +1,89 @@
+General Purpose Analog To Digital Converter (ADC) based thermal sensor.
+
+On some of platforms, thermal sensor like thermistors are connected to
+one of ADC channel and sensor resistance is read via voltage across the
+sensor resistor. The voltage read across the sensor is mapped to
+temperature using voltage-temperature lookup table.
+
+Required properties:
+===================
+- compatible: Must be "generic-adc-thermal".
+- temperature-lookup-table: Two dimensional array of Integer; lookup table
+ to map the relation between ADC value and
+ temperature. When ADC is read, the value is
+ looked up on the table to get the equivalent
+ temperature.
+ The first value of the each row of array is the
+ temperature in milliCelsius and second value of
+ the each row of array is the ADC read value.
+- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description
+ of this property.
+
+Example :
+#include <dt-bindings/thermal/thermal.h>
+
+i2c@7000c400 {
+ ads1015: ads1015@4a {
+ reg = <0x4a>;
+ compatible = "ads1015";
+ sampling-frequency = <3300>;
+ #io-channel-cells = <1>;
+ };
+};
+
+tboard_thermistor: thermal-sensor {
+ compatible = "generic-adc-thermal";
+ #thermal-sensor-cells = <0>;
+ io-channels = <&ads1015 1>;
+ io-channel-names = "sensor-channel";
+ temperature-lookup-table = < (-40000) 2578
+ (-39000) 2577
+ (-38000) 2576
+ (-37000) 2575
+ (-36000) 2574
+ (-35000) 2573
+ (-34000) 2572
+ (-33000) 2571
+ (-32000) 2569
+ (-31000) 2568
+ (-30000) 2567
+ ::::::::::
+ 118000 254
+ 119000 247
+ 120000 240
+ 121000 233
+ 122000 226
+ 123000 220
+ 124000 214
+ 125000 208>;
+};
+
+dummy_cool_dev: dummy-cool-dev {
+ compatible = "dummy-cooling-dev";
+ #cooling-cells = <2>; /* min followed by max */
+};
+
+thermal-zones {
+ Tboard {
+ polling-delay = <15000>; /* milliseconds */
+ polling-delay-passive = <0>; /* milliseconds */
+ thermal-sensors = <&tboard_thermistor>;
+
+ trips {
+ therm_est_trip: therm_est_trip {
+ temperature = <40000>;
+ type = "active";
+ hysteresis = <1000>;
+ };
+ };
+
+ cooling-maps {
+ map0 {
+ trip = <&therm_est_trip>;
+ cooling-device = <&dummy_cool_dev THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
+ contribution = <100>;
+ };
+
+ };
+ };
+};
diff --git a/Documentation/thermal/sysfs-api.txt b/Documentation/thermal/sysfs-api.txt
index ed419d6c8dec..efc3f3d293c4 100644
--- a/Documentation/thermal/sysfs-api.txt
+++ b/Documentation/thermal/sysfs-api.txt
@@ -69,8 +69,8 @@ temperature) and throttle appropriate devices.
1.1.2 void thermal_zone_device_unregister(struct thermal_zone_device *tz)
This interface function removes the thermal zone device.
- It deletes the corresponding entry form /sys/class/thermal folder and
- unbind all the thermal cooling devices it uses.
+ It deletes the corresponding entry from /sys/class/thermal folder and
+ unbinds all the thermal cooling devices it uses.
1.1.3 struct thermal_zone_device *thermal_zone_of_sensor_register(
struct device *dev, int sensor_id, void *data,
@@ -146,32 +146,32 @@ temperature) and throttle appropriate devices.
This interface function adds a new thermal cooling device (fan/processor/...)
to /sys/class/thermal/ folder as cooling_device[0-*]. It tries to bind itself
- to all the thermal zone devices register at the same time.
+ to all the thermal zone devices registered at the same time.
name: the cooling device name.
devdata: device private data.
ops: thermal cooling devices call-backs.
.get_max_state: get the Maximum throttle state of the cooling device.
- .get_cur_state: get the Current throttle state of the cooling device.
+ .get_cur_state: get the Currently requested throttle state of the cooling device.
.set_cur_state: set the Current throttle state of the cooling device.
1.2.2 void thermal_cooling_device_unregister(struct thermal_cooling_device *cdev)
- This interface function remove the thermal cooling device.
- It deletes the corresponding entry form /sys/class/thermal folder and
- unbind itself from all the thermal zone devices using it.
+ This interface function removes the thermal cooling device.
+ It deletes the corresponding entry from /sys/class/thermal folder and
+ unbinds itself from all the thermal zone devices using it.
1.3 interface for binding a thermal zone device with a thermal cooling device
1.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz,
int trip, struct thermal_cooling_device *cdev,
unsigned long upper, unsigned long lower, unsigned int weight);
- This interface function bind a thermal cooling device to the certain trip
+ This interface function binds a thermal cooling device to a particular trip
point of a thermal zone device.
This function is usually called in the thermal zone device .bind callback.
tz: the thermal zone device
cdev: thermal cooling device
- trip: indicates which trip point the cooling devices is associated with
- in this thermal zone.
+ trip: indicates which trip point in this thermal zone the cooling device
+ is associated with.
upper:the Maximum cooling state for this trip point.
THERMAL_NO_LIMIT means no upper limit,
and the cooling device can be in max_state.
@@ -184,13 +184,13 @@ temperature) and throttle appropriate devices.
1.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz,
int trip, struct thermal_cooling_device *cdev);
- This interface function unbind a thermal cooling device from the certain
+ This interface function unbinds a thermal cooling device from a particular
trip point of a thermal zone device. This function is usually called in
the thermal zone device .unbind callback.
tz: the thermal zone device
cdev: thermal cooling device
- trip: indicates which trip point the cooling devices is associated with
- in this thermal zone.
+ trip: indicates which trip point in this thermal zone the cooling device
+ is associated with.
1.4 Thermal Zone Parameters
1.4.1 struct thermal_bind_params
@@ -210,13 +210,13 @@ temperature) and throttle appropriate devices.
this thermal zone and cdev, for a particular trip point.
If nth bit is set, then the cdev and thermal zone are bound
for trip point n.
- .limits: This is an array of cooling state limits. Must have exactly
- 2 * thermal_zone.number_of_trip_points. It is an array consisting
- of tuples <lower-state upper-state> of state limits. Each trip
- will be associated with one state limit tuple when binding.
- A NULL pointer means <THERMAL_NO_LIMITS THERMAL_NO_LIMITS>
- on all trips. These limits are used when binding a cdev to a
- trip point.
+ .binding_limits: This is an array of cooling state limits. Must have
+ exactly 2 * thermal_zone.number_of_trip_points. It is an
+ array consisting of tuples <lower-state upper-state> of
+ state limits. Each trip will be associated with one state
+ limit tuple when binding. A NULL pointer means
+ <THERMAL_NO_LIMITS THERMAL_NO_LIMITS> on all trips.
+ These limits are used when binding a cdev to a trip point.
.match: This call back returns success(0) if the 'tz and cdev' need to
be bound, as per platform data.
1.4.2 struct thermal_zone_params
@@ -351,8 +351,8 @@ cdev[0-*]
RO, Optional
cdev[0-*]_trip_point
- The trip point with which cdev[0-*] is associated in this thermal
- zone; -1 means the cooling device is not associated with any trip
+ The trip point in this thermal zone which cdev[0-*] is associated
+ with; -1 means the cooling device is not associated with any trip
point.
RO, Optional