Merge branch 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/lenb/linux

Pull ACPI & Thermal updates from Len Brown:
 "The generic Linux thermal layer is gaining some new capabilities
  (generic cooling via cpufreq) and some new customers (ARM).

  Also, an ACPI EC bug fix plus a regression fix."

* 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/lenb/linux: (30 commits)
  tools/power/acpi/acpidump: remove duplicated include from acpidump.c
  ACPI idle, CPU hotplug: Fix NULL pointer dereference during hotplug
  cpuidle / ACPI: fix potential NULL pointer dereference
  ACPI: EC: Add a quirk for CLEVO M720T/M730T laptop
  ACPI: EC: Make the GPE storm threshold a module parameter
  thermal: Exynos: Fix NULL pointer dereference in exynos_unregister_thermal()
  Thermal: Fix bug on cpu_cooling, cooling device's id conflict problem.
  thermal: exynos: Use devm_* functions
  ARM: exynos: add thermal sensor driver platform data support
  thermal: exynos: register the tmu sensor with the kernel thermal layer
  thermal: exynos5: add exynos5250 thermal sensor driver support
  hwmon: exynos4: move thermal sensor driver to driver/thermal directory
  thermal: add generic cpufreq cooling implementation
  Fix a build error.
  thermal: Fix potential NULL pointer accesses
  thermal: add Renesas R-Car thermal sensor support
  thermal: fix potential out-of-bounds memory access
  Thermal: Introduce locking for cdev.thermal_instances list.
  Thermal: Unify the code for both active and passive cooling
  Thermal: Introduce simple arbitrator for setting device cooling state
  ...

1 files changed, 52 insertions, 0 deletions

diff --git a/Documentation/thermal/exynos_thermal b/Documentation/thermal/exynos_thermal
new file mode 100644
index 000000000000..2b46f67b1ccb
--- /dev/null
+++ b/Documentation/thermal/exynos_thermal
@@ -0,0 +1,52 @@
+Kernel driver exynos4_tmu
+=================
+
+Supported chips:
+* ARM SAMSUNG EXYNOS4 series of SoC
+  Prefix: 'exynos4-tmu'
+  Datasheet: Not publicly available
+
+Authors: Donggeun Kim <dg77.kim@samsung.com>
+
+Description
+-----------
+
+This driver allows to read temperature inside SAMSUNG EXYNOS4 series of SoC.
+
+The chip only exposes the measured 8-bit temperature code value
+through a register.
+Temperature can be taken from the temperature code.
+There are three equations converting from temperature to temperature code.
+
+The three equations are:
+  1. Two point trimming
+	Tc = (T - 25) * (TI2 - TI1) / (85 - 25) + TI1
+
+  2. One point trimming
+	Tc = T + TI1 - 25
+
+  3. No trimming
+	Tc = T + 50
+
+  Tc: Temperature code, T: Temperature,
+  TI1: Trimming info for 25 degree Celsius (stored at TRIMINFO register)
+       Temperature code measured at 25 degree Celsius which is unchanged
+  TI2: Trimming info for 85 degree Celsius (stored at TRIMINFO register)
+       Temperature code measured at 85 degree Celsius which is unchanged
+
+TMU(Thermal Management Unit) in EXYNOS4 generates interrupt
+when temperature exceeds pre-defined levels.
+The maximum number of configurable threshold is four.
+The threshold levels are defined as follows:
+  Level_0: current temperature > trigger_level_0 + threshold
+  Level_1: current temperature > trigger_level_1 + threshold
+  Level_2: current temperature > trigger_level_2 + threshold
+  Level_3: current temperature > trigger_level_3 + threshold
+
+  The threshold and each trigger_level are set
+  through the corresponding registers.
+
+When an interrupt occurs, this driver notify kernel thermal framework
+with the function exynos4_report_trigger.
+Although an interrupt condition for level_0 can be set,
+it can be used to synchronize the cooling action.