diff options
Diffstat (limited to 'Documentation')
| -rw-r--r-- | Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt | 23 | ||||
| -rw-r--r-- | Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt | 57 | ||||
| -rw-r--r-- | Documentation/devicetree/bindings/thermal/thermal.txt | 9 | ||||
| -rw-r--r-- | Documentation/thermal/cpu-cooling-api.txt | 156 | ||||
| -rw-r--r-- | Documentation/thermal/power_allocator.txt | 247 | ||||
| -rw-r--r-- | Documentation/thermal/sysfs-api.txt | 99 |
6 files changed, 585 insertions, 6 deletions
diff --git a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt new file mode 100644 index 000000000000..d48fc5280d5a --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt @@ -0,0 +1,23 @@ +* Temperature Sensor on hisilicon SoCs + +** Required properties : + +- compatible: "hisilicon,tsensor". +- reg: physical base address of thermal sensor and length of memory mapped + region. +- interrupt: The interrupt number to the cpu. Defines the interrupt used + by /SOCTHERM/tsensor. +- clock-names: Input clock name, should be 'thermal_clk'. +- clocks: phandles for clock specified in "clock-names" property. +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description. + +Example : + + tsensor: tsensor@0,f7030700 { + compatible = "hisilicon,tsensor"; + reg = <0x0 0xf7030700 0x0 0x1000>; + interrupts = <0 7 0x4>; + clocks = <&sys_ctrl HI6220_TSENSOR_CLK>; + clock-names = "thermal_clk"; + #thermal-sensor-cells = <1>; + } diff --git a/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt b/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt new file mode 100644 index 000000000000..290ec06fa33a --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt @@ -0,0 +1,57 @@ +Qualcomm QPNP PMIC Temperature Alarm + +QPNP temperature alarm peripherals are found inside of Qualcomm PMIC chips +that utilize the Qualcomm SPMI implementation. These peripherals provide an +interrupt signal and status register to identify high PMIC die temperature. + +Required properties: +- compatible: Should contain "qcom,spmi-temp-alarm". +- reg: Specifies the SPMI address and length of the controller's + registers. +- interrupts: PMIC temperature alarm interrupt. +- #thermal-sensor-cells: Should be 0. See thermal.txt for a description. + +Optional properties: +- io-channels: Should contain IIO channel specifier for the ADC channel, + which report chip die temperature. +- io-channel-names: Should contain "thermal". + +Example: + + pm8941_temp: thermal-alarm@2400 { + compatible = "qcom,spmi-temp-alarm"; + reg = <0x2400 0x100>; + interrupts = <0 0x24 0 IRQ_TYPE_EDGE_RISING>; + #thermal-sensor-cells = <0>; + + io-channels = <&pm8941_vadc VADC_DIE_TEMP>; + io-channel-names = "thermal"; + }; + + thermal-zones { + pm8941 { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&pm8941_temp>; + + trips { + passive { + temperature = <1050000>; + hysteresis = <2000>; + type = "passive"; + }; + alert { + temperature = <125000>; + hysteresis = <2000>; + type = "hot"; + }; + crit { + temperature = <145000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + }; + }; + diff --git a/Documentation/devicetree/bindings/thermal/thermal.txt b/Documentation/devicetree/bindings/thermal/thermal.txt index 29fe0bfae38e..8a49362dea6e 100644 --- a/Documentation/devicetree/bindings/thermal/thermal.txt +++ b/Documentation/devicetree/bindings/thermal/thermal.txt @@ -167,6 +167,13 @@ Optional property: by means of sensor ID. Additional coefficients are interpreted as constant offset. +- sustainable-power: An estimate of the sustainable power (in mW) that the + Type: unsigned thermal zone can dissipate at the desired + Size: one cell control temperature. For reference, the + sustainable power of a 4'' phone is typically + 2000mW, while on a 10'' tablet is around + 4500mW. + Note: The delay properties are bound to the maximum dT/dt (temperature derivative over time) in two situations for a thermal zone: (i) - when passive cooling is activated (polling-delay-passive); and @@ -546,6 +553,8 @@ thermal-zones { */ coefficients = <1200 -345 890>; + sustainable-power = <2500>; + trips { /* Trips are based on resulting linear equation */ cpu_trip: cpu-trip { diff --git a/Documentation/thermal/cpu-cooling-api.txt b/Documentation/thermal/cpu-cooling-api.txt index 753e47cc2e20..71653584cd03 100644 --- a/Documentation/thermal/cpu-cooling-api.txt +++ b/Documentation/thermal/cpu-cooling-api.txt @@ -36,8 +36,162 @@ the user. The registration APIs returns the cooling device pointer. np: pointer to the cooling device device tree node clip_cpus: cpumask of cpus where the frequency constraints will happen. -1.1.3 void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) +1.1.3 struct thermal_cooling_device *cpufreq_power_cooling_register( + const struct cpumask *clip_cpus, u32 capacitance, + get_static_t plat_static_func) + +Similar to cpufreq_cooling_register, this function registers a cpufreq +cooling device. Using this function, the cooling device will +implement the power extensions by using a simple cpu power model. The +cpus must have registered their OPPs using the OPP library. + +The additional parameters are needed for the power model (See 2. Power +models). "capacitance" is the dynamic power coefficient (See 2.1 +Dynamic power). "plat_static_func" is a function to calculate the +static power consumed by these cpus (See 2.2 Static power). + +1.1.4 struct thermal_cooling_device *of_cpufreq_power_cooling_register( + struct device_node *np, const struct cpumask *clip_cpus, u32 capacitance, + get_static_t plat_static_func) + +Similar to cpufreq_power_cooling_register, this function register a +cpufreq cooling device with power extensions using the device tree +information supplied by the np parameter. + +1.1.5 void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) This interface function unregisters the "thermal-cpufreq-%x" cooling device. cdev: Cooling device pointer which has to be unregistered. + +2. Power models + +The power API registration functions provide a simple power model for +CPUs. The current power is calculated as dynamic + (optionally) +static power. This power model requires that the operating-points of +the CPUs are registered using the kernel's opp library and the +`cpufreq_frequency_table` is assigned to the `struct device` of the +cpu. If you are using CONFIG_CPUFREQ_DT then the +`cpufreq_frequency_table` should already be assigned to the cpu +device. + +The `plat_static_func` parameter of `cpufreq_power_cooling_register()` +and `of_cpufreq_power_cooling_register()` is optional. If you don't +provide it, only dynamic power will be considered. + +2.1 Dynamic power + +The dynamic power consumption of a processor depends on many factors. +For a given processor implementation the primary factors are: + +- The time the processor spends running, consuming dynamic power, as + compared to the time in idle states where dynamic consumption is + negligible. Herein we refer to this as 'utilisation'. +- The voltage and frequency levels as a result of DVFS. The DVFS + level is a dominant factor governing power consumption. +- In running time the 'execution' behaviour (instruction types, memory + access patterns and so forth) causes, in most cases, a second order + variation. In pathological cases this variation can be significant, + but typically it is of a much lesser impact than the factors above. + +A high level dynamic power consumption model may then be represented as: + +Pdyn = f(run) * Voltage^2 * Frequency * Utilisation + +f(run) here represents the described execution behaviour and its +result has a units of Watts/Hz/Volt^2 (this often expressed in +mW/MHz/uVolt^2) + +The detailed behaviour for f(run) could be modelled on-line. However, +in practice, such an on-line model has dependencies on a number of +implementation specific processor support and characterisation +factors. Therefore, in initial implementation that contribution is +represented as a constant coefficient. This is a simplification +consistent with the relative contribution to overall power variation. + +In this simplified representation our model becomes: + +Pdyn = Capacitance * Voltage^2 * Frequency * Utilisation + +Where `capacitance` is a constant that represents an indicative +running time dynamic power coefficient in fundamental units of +mW/MHz/uVolt^2. Typical values for mobile CPUs might lie in range +from 100 to 500. For reference, the approximate values for the SoC in +ARM's Juno Development Platform are 530 for the Cortex-A57 cluster and +140 for the Cortex-A53 cluster. + + +2.2 Static power + +Static leakage power consumption depends on a number of factors. For a +given circuit implementation the primary factors are: + +- Time the circuit spends in each 'power state' +- Temperature +- Operating voltage +- Process grade + +The time the circuit spends in each 'power state' for a given +evaluation period at first order means OFF or ON. However, +'retention' states can also be supported that reduce power during +inactive periods without loss of context. + +Note: The visibility of state entries to the OS can vary, according to +platform specifics, and this can then impact the accuracy of a model +based on OS state information alone. It might be possible in some +cases to extract more accurate information from system resources. + +The temperature, operating voltage and process 'grade' (slow to fast) +of the circuit are all significant factors in static leakage power +consumption. All of these have complex relationships to static power. + +Circuit implementation specific factors include the chosen silicon +process as well as the type, number and size of transistors in both +the logic gates and any RAM elements included. + +The static power consumption modelling must take into account the +power managed regions that are implemented. Taking the example of an +ARM processor cluster, the modelling would take into account whether +each CPU can be powered OFF separately or if only a single power +region is implemented for the complete cluster. + +In one view, there are others, a static power consumption model can +then start from a set of reference values for each power managed +region (e.g. CPU, Cluster/L2) in each state (e.g. ON, OFF) at an +arbitrary process grade, voltage and temperature point. These values +are then scaled for all of the following: the time in each state, the +process grade, the current temperature and the operating voltage. +However, since both implementation specific and complex relationships +dominate the estimate, the appropriate interface to the model from the +cpu cooling device is to provide a function callback that calculates +the static power in this platform. When registering the cpu cooling +device pass a function pointer that follows the `get_static_t` +prototype: + + int plat_get_static(cpumask_t *cpumask, int interval, + unsigned long voltage, u32 &power); + +`cpumask` is the cpumask of the cpus involved in the calculation. +`voltage` is the voltage at which they are operating. The function +should calculate the average static power for the last `interval` +milliseconds. It returns 0 on success, -E* on error. If it +succeeds, it should store the static power in `power`. Reading the +temperature of the cpus described by `cpumask` is left for +plat_get_static() to do as the platform knows best which thermal +sensor is closest to the cpu. + +If `plat_static_func` is NULL, static power is considered to be +negligible for this platform and only dynamic power is considered. + +The platform specific callback can then use any combination of tables +and/or equations to permute the estimated value. Process grade +information is not passed to the model since access to such data, from +on-chip measurement capability or manufacture time data, is platform +specific. + +Note: the significance of static power for CPUs in comparison to +dynamic power is highly dependent on implementation. Given the +potential complexity in implementation, the importance and accuracy of +its inclusion when using cpu cooling devices should be assessed on a +case by case basis. + diff --git a/Documentation/thermal/power_allocator.txt b/Documentation/thermal/power_allocator.txt new file mode 100644 index 000000000000..c3797b529991 --- /dev/null +++ b/Documentation/thermal/power_allocator.txt @@ -0,0 +1,247 @@ +Power allocator governor tunables +================================= + +Trip points +----------- + +The governor requires the following two passive trip points: + +1. "switch on" trip point: temperature above which the governor + control loop starts operating. This is the first passive trip + point of the thermal zone. + +2. "desired temperature" trip point: it should be higher than the + "switch on" trip point. This the target temperature the governor + is controlling for. This is the last passive trip point of the + thermal zone. + +PID Controller +-------------- + +The power allocator governor implements a +Proportional-Integral-Derivative controller (PID controller) with +temperature as the control input and power as the controlled output: + + P_max = k_p * e + k_i * err_integral + k_d * diff_err + sustainable_power + +where + e = desired_temperature - current_temperature + err_integral is the sum of previous errors + diff_err = e - previous_error + +It is similar to the one depicted below: + + k_d + | +current_temp | + | v + | +----------+ +---+ + | +----->| diff_err |-->| X |------+ + | | +----------+ +---+ | + | | | tdp actor + | | k_i | | get_requested_power() + | | | | | | | + | | | | | | | ... + v | v v v v v + +---+ | +-------+ +---+ +---+ +---+ +----------+ + | S |-------+----->| sum e |----->| X |--->| S |-->| S |-->|power | + +---+ | +-------+ +---+ +---+ +---+ |allocation| + ^ | ^ +----------+ + | | | | | + | | +---+ | | | + | +------->| X |-------------------+ v v + | +---+ granted performance +desired_temperature ^ + | + | + k_po/k_pu + +Sustainable power +----------------- + +An estimate of the sustainable dissipatable power (in mW) should be +provided while registering the thermal zone. This estimates the +sustained power that can be dissipated at the desired control +temperature. This is the maximum sustained power for allocation at +the desired maximum temperature. The actual sustained power can vary +for a number of reasons. The closed loop controller will take care of +variations such as environmental conditions, and some factors related +to the speed-grade of the silicon. `sustainable_power` is therefore +simply an estimate, and may be tuned to affect the aggressiveness of +the thermal ramp. For reference, the sustainable power of a 4" phone +is typically 2000mW, while on a 10" tablet is around 4500mW (may vary +depending on screen size). + +If you are using device tree, do add it as a property of the +thermal-zone. For example: + + thermal-zones { + soc_thermal { + polling-delay = <1000>; + polling-delay-passive = <100>; + sustainable-power = <2500>; + ... + +Instead, if the thermal zone is registered from the platform code, pass a +`thermal_zone_params` that has a `sustainable_power`. If no +`thermal_zone_params` were being passed, then something like below +will suffice: + + static const struct thermal_zone_params tz_params = { + .sustainable_power = 3500, + }; + +and then pass `tz_params` as the 5th parameter to +`thermal_zone_device_register()` + +k_po and k_pu +------------- + +The implementation of the PID controller in the power allocator +thermal governor allows the configuration of two proportional term +constants: `k_po` and `k_pu`. `k_po` is the proportional term +constant during temperature overshoot periods (current temperature is +above "desired temperature" trip point). Conversely, `k_pu` is the +proportional term constant during temperature undershoot periods +(current temperature below "desired temperature" trip point). + +These controls are intended as the primary mechanism for configuring +the permitted thermal "ramp" of the system. For instance, a lower +`k_pu` value will provide a slower ramp, at the cost of capping +available capacity at a low temperature. On the other hand, a high +value of `k_pu` will result in the governor granting very high power +whilst temperature is low, and may lead to temperature overshooting. + +The default value for `k_pu` is: + + 2 * sustainable_power / (desired_temperature - switch_on_temp) + +This means that at `switch_on_temp` the output of the controller's +proportional term will be 2 * `sustainable_power`. The default value +for `k_po` is: + + sustainable_power / (desired_temperature - switch_on_temp) + +Focusing on the proportional and feed forward values of the PID +controller equation we have: + + P_max = k_p * e + sustainable_power + +The proportional term is proportional to the difference between the +desired temperature and the current one. When the current temperature +is the desired one, then the proportional component is zero and +`P_max` = `sustainable_power`. That is, the system should operate in +thermal equilibrium under constant load. `sustainable_power` is only +an estimate, which is the reason for closed-loop control such as this. + +Expanding `k_pu` we get: + P_max = 2 * sustainable_power * (T_set - T) / (T_set - T_on) + + sustainable_power + +where + T_set is the desired temperature + T is the current temperature + T_on is the switch on temperature + +When the current temperature is the switch_on temperature, the above +formula becomes: + + P_max = 2 * sustainable_power * (T_set - T_on) / (T_set - T_on) + + sustainable_power = 2 * sustainable_power + sustainable_power = + 3 * sustainable_power + +Therefore, the proportional term alone linearly decreases power from +3 * `sustainable_power` to `sustainable_power` as the temperature +rises from the switch on temperature to the desired temperature. + +k_i and integral_cutoff +----------------------- + +`k_i` configures the PID loop's integral term constant. This term +allows the PID controller to compensate for long term drift and for +the quantized nature of the output control: cooling devices can't set +the exact power that the governor requests. When the temperature +error is below `integral_cutoff`, errors are accumulated in the +integral term. This term is then multiplied by `k_i` and the result +added to the output of the controller. Typically `k_i` is set low (1 +or 2) and `integral_cutoff` is 0. + +k_d +--- + +`k_d` configures the PID loop's derivative term constant. It's +recommended to leave it as the default: 0. + +Cooling device power API +======================== + +Cooling devices controlled by this governor must supply the additional +"power" API in their `cooling_device_ops`. It consists on three ops: + +1. int get_requested_power(struct thermal_cooling_device *cdev, + struct thermal_zone_device *tz, u32 *power); +@cdev: The `struct thermal_cooling_device` pointer +@tz: thermal zone in which we are currently operating +@power: pointer in which to store the calculated power + +`get_requested_power()` calculates the power requested by the device +in milliwatts and stores it in @power . It should return 0 on +success, -E* on failure. This is currently used by the power +allocator governor to calculate how much power to give to each cooling +device. + +2. int state2power(struct thermal_cooling_device *cdev, struct + thermal_zone_device *tz, unsigned long state, u32 *power); +@cdev: The `struct thermal_cooling_device` pointer +@tz: thermal zone in which we are currently operating +@state: A cooling device state +@power: pointer in which to store the equivalent power + +Convert cooling device state @state into power consumption in +milliwatts and store it in @power. It should return 0 on success, -E* +on failure. This is currently used by thermal core to calculate the +maximum power that an actor can consume. + +3. int power2state(struct thermal_cooling_device *cdev, u32 power, + unsigned long *state); +@cdev: The `struct thermal_cooling_device` pointer +@power: power in milliwatts +@state: pointer in which to store the resulting state + +Calculate a cooling device state that would make the device consume at +most @power mW and store it in @state. It should return 0 on success, +-E* on failure. This is currently used by the thermal core to convert +a given power set by the power allocator governor to a state that the +cooling device can set. It is a function because this conversion may +depend on external factors that may change so this function should the +best conversion given "current circumstances". + +Cooling device weights +---------------------- + +Weights are a mechanism to bias the allocation among cooling +devices. They express the relative power efficiency of different +cooling devices. Higher weight can be used to express higher power +efficiency. Weighting is relative such that if each cooling device +has a weight of one they are considered equal. This is particularly +useful in heterogeneous systems where two cooling devices may perform +the same kind of compute, but with different efficiency. For example, +a system with two different types of processors. + +If the thermal zone is registered using +`thermal_zone_device_register()` (i.e., platform code), then weights +are passed as part of the thermal zone's `thermal_bind_parameters`. +If the platform is registered using device tree, then they are passed +as the `contribution` property of each map in the `cooling-maps` node. + +Limitations of the power allocator governor +=========================================== + +The power allocator governor's PID controller works best if there is a +periodic tick. If you have a driver that calls +`thermal_zone_device_update()` (or anything that ends up calling the +governor's `throttle()` function) repetitively, the governor response +won't be very good. Note that this is not particular to this +governor, step-wise will also misbehave if you call its throttle() +faster than the normal thermal framework tick (due to interrupts for +example) as it will overreact. diff --git a/Documentation/thermal/sysfs-api.txt b/Documentation/thermal/sysfs-api.txt index 87519cb379ee..c1f6864a8c5d 100644 --- a/Documentation/thermal/sysfs-api.txt +++ b/Documentation/thermal/sysfs-api.txt @@ -95,7 +95,7 @@ temperature) and throttle appropriate devices. 1.3 interface for binding a thermal zone device with a thermal cooling device 1.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz, int trip, struct thermal_cooling_device *cdev, - unsigned long upper, unsigned long lower); + unsigned long upper, unsigned long lower, unsigned int weight); This interface function bind a thermal cooling device to the certain trip point of a thermal zone device. @@ -110,6 +110,8 @@ temperature) and throttle appropriate devices. lower:the Minimum cooling state can be used for this trip point. THERMAL_NO_LIMIT means no lower limit, and the cooling device can be in cooling state 0. + weight: the influence of this cooling device in this thermal + zone. See 1.4.1 below for more information. 1.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz, int trip, struct thermal_cooling_device *cdev); @@ -127,9 +129,15 @@ temperature) and throttle appropriate devices. This structure defines the following parameters that are used to bind a zone with a cooling device for a particular trip point. .cdev: The cooling device pointer - .weight: The 'influence' of a particular cooling device on this zone. - This is on a percentage scale. The sum of all these weights - (for a particular zone) cannot exceed 100. + .weight: The 'influence' of a particular cooling device on this + zone. This is relative to the rest of the cooling + devices. For example, if all cooling devices have a + weight of 1, then they all contribute the same. You can + use percentages if you want, but it's not mandatory. A + weight of 0 means that this cooling device doesn't + contribute to the cooling of this zone unless all cooling + devices have a weight of 0. If all weights are 0, then + they all contribute the same. .trip_mask:This is a bit mask that gives the binding relation between this thermal zone and cdev, for a particular trip point. If nth bit is set, then the cdev and thermal zone are bound @@ -176,6 +184,14 @@ Thermal zone device sys I/F, created once it's registered: |---trip_point_[0-*]_type: Trip point type |---trip_point_[0-*]_hyst: Hysteresis value for this trip point |---emul_temp: Emulated temperature set node + |---sustainable_power: Sustainable dissipatable power + |---k_po: Proportional term during temperature overshoot + |---k_pu: Proportional term during temperature undershoot + |---k_i: PID's integral term in the power allocator gov + |---k_d: PID's derivative term in the power allocator + |---integral_cutoff: Offset above which errors are accumulated + |---slope: Slope constant applied as linear extrapolation + |---offset: Offset constant applied as linear extrapolation Thermal cooling device sys I/F, created once it's registered: /sys/class/thermal/cooling_device[0-*]: @@ -192,6 +208,8 @@ thermal_zone_bind_cooling_device/thermal_zone_unbind_cooling_device. /sys/class/thermal/thermal_zone[0-*]: |---cdev[0-*]: [0-*]th cooling device in current thermal zone |---cdev[0-*]_trip_point: Trip point that cdev[0-*] is associated with + |---cdev[0-*]_weight: Influence of the cooling device in + this thermal zone Besides the thermal zone device sysfs I/F and cooling device sysfs I/F, the generic thermal driver also creates a hwmon sysfs I/F for each _type_ @@ -265,6 +283,14 @@ cdev[0-*]_trip_point point. RO, Optional +cdev[0-*]_weight + The influence of cdev[0-*] in this thermal zone. This value + is relative to the rest of cooling devices in the thermal + zone. For example, if a cooling device has a weight double + than that of other, it's twice as effective in cooling the + thermal zone. + RW, Optional + passive Attribute is only present for zones in which the passive cooling policy is not supported by native thermal driver. Default is zero @@ -289,6 +315,66 @@ emul_temp because userland can easily disable the thermal policy by simply flooding this sysfs node with low temperature values. +sustainable_power + An estimate of the sustained power that can be dissipated by + the thermal zone. Used by the power allocator governor. For + more information see Documentation/thermal/power_allocator.txt + Unit: milliwatts + RW, Optional + +k_po + The proportional term of the power allocator governor's PID + controller during temperature overshoot. Temperature overshoot + is when the current temperature is above the "desired + temperature" trip point. For more information see + Documentation/thermal/power_allocator.txt + RW, Optional + +k_pu + The proportional term of the power allocator governor's PID + controller during temperature undershoot. Temperature undershoot + is when the current temperature is below the "desired + temperature" trip point. For more information see + Documentation/thermal/power_allocator.txt + RW, Optional + +k_i + The integral term of the power allocator governor's PID + controller. This term allows the PID controller to compensate + for long term drift. For more information see + Documentation/thermal/power_allocator.txt + RW, Optional + +k_d + The derivative term of the power allocator governor's PID + controller. For more information see + Documentation/thermal/power_allocator.txt + RW, Optional + +integral_cutoff + Temperature offset from the desired temperature trip point + above which the integral term of the power allocator + governor's PID controller starts accumulating errors. For + example, if integral_cutoff is 0, then the integral term only + accumulates error when temperature is above the desired + temperature trip point. For more information see + Documentation/thermal/power_allocator.txt + RW, Optional + +slope + The slope constant used in a linear extrapolation model + to determine a hotspot temperature based off the sensor's + raw readings. It is up to the device driver to determine + the usage of these values. + RW, Optional + +offset + The offset constant used in a linear extrapolation model + to determine a hotspot temperature based off the sensor's + raw readings. It is up to the device driver to determine + the usage of these values. + RW, Optional + ***************************** * Cooling device attributes * ***************************** @@ -318,7 +404,8 @@ passive, active. If an ACPI thermal zone supports critical, passive, active[0] and active[1] at the same time, it may register itself as a thermal_zone_device (thermal_zone1) with 4 trip points in all. It has one processor and one fan, which are both registered as -thermal_cooling_device. +thermal_cooling_device. Both are considered to have the same +effectiveness in cooling the thermal zone. If the processor is listed in _PSL method, and the fan is listed in _AL0 method, the sys I/F structure will be built like this: @@ -340,8 +427,10 @@ method, the sys I/F structure will be built like this: |---trip_point_3_type: active1 |---cdev0: --->/sys/class/thermal/cooling_device0 |---cdev0_trip_point: 1 /* cdev0 can be used for passive */ + |---cdev0_weight: 1024 |---cdev1: --->/sys/class/thermal/cooling_device3 |---cdev1_trip_point: 2 /* cdev1 can be used for active[0]*/ + |---cdev1_weight: 1024 |cooling_device0: |---type: Processor |