Merge tag 'thermal-v5.8-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux

Pull thermal updates from Daniel Lezcano:

 - Add the hwmon support on the i.MX SC (Anson Huang)

 - Thermal framework cleanups (self-encapsulation, pointless stubs,
   private structures) (Daniel Lezcano)

 - Use the PM QoS frequency changes for the devfreq cooling device
   (Matthias Kaehlcke)

 - Remove duplicate error messages from platform_get_irq() error
   handling (Markus Elfring)

 - Add support for the bandgap sensors (Keerthy)

 - Statically initialize .get_mode/.set_mode ops (Andrzej Pietrasiewicz)

 - Add Renesas R-Car maintainer entry (Niklas Söderlund)

 - Fix error checking after calling ti_bandgap_get_sensor_data() for the
   TI SoC thermal (Sudip Mukherjee)

 - Add latency constraint for the idle injection, the DT binding and the
   change the registering function (Daniel Lezcano)

 - Convert the thermal framework binding to the Yaml schema (Amit
   Kucheria)

 - Replace zero-length array with flexible-array on i.MX 8MM (Gustavo A.
   R. Silva)

 - Thermal framework cleanups (alphabetic order for heads, replace
   module.h by export.h, make file naming consistent) (Amit Kucheria)

 - Merge tsens-common into the tsens driver (Amit Kucheria)

 - Fix platform dependency for the Qoriq driver (Geert Uytterhoeven)

 - Clean up the rcar_thermal_update_temp() function in the rcar thermal
   driver (Niklas Söderlund)

 - Fix the TMSAR register for the TMUv2 on the Qoriq platform (Yuantian
   Tang)

 - Export GDDV, OEM vendor variables, and don't require IDSP for the
   int340x thermal driver - trivial conflicts fixed (Matthew Garrett)

* tag 'thermal-v5.8-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (48 commits)
  thermal/int340x_thermal: Don't require IDSP to exist
  thermal/int340x_thermal: Export OEM vendor variables
  thermal/int340x_thermal: Export GDDV
  thermal: qoriq: Update the settings for TMUv2
  thermal: rcar_thermal: Clean up rcar_thermal_update_temp()
  thermal: qoriq: Add platform dependencies
  drivers: thermal: tsens: Merge tsens-common.c into tsens.c
  thermal/of: Rename of-thermal.c
  thermal/governors: Prefix all source files with gov_
  thermal/drivers/user_space: Sort headers alphabetically
  thermal/drivers/of-thermal: Sort headers alphabetically
  thermal/drivers/cpufreq_cooling: Replace module.h with export.h
  thermal/drivers/cpufreq_cooling: Sort headers alphabetically
  thermal/drivers/clock_cooling: Include export.h
  thermal/drivers/clock_cooling: Sort headers alphabetically
  thermal/drivers/thermal_hwmon: Include export.h
  thermal/drivers/thermal_hwmon: Sort headers alphabetically
  thermal/drivers/thermal_helpers: Include export.h
  thermal/drivers/thermal_helpers: Sort headers alphabetically
  thermal/core: Replace module.h with export.h
  ...

5 files changed, 730 insertions, 0 deletions

diff --git a/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml b/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
new file mode 100644
index 000000000000..5145883d932e
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
@@ -0,0 +1,116 @@
+# SPDX-License-Identifier: (GPL-2.0)
+# Copyright 2020 Linaro Ltd.
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/thermal-cooling-devices.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: Thermal cooling device binding
+
+maintainers:
+  - Amit Kucheria <amitk@kernel.org>
+
+description: |
+  Thermal management is achieved in devicetree by describing the sensor hardware
+  and the software abstraction of cooling devices and thermal zones required to
+  take appropriate action to mitigate thermal overload.
+
+  The following node types are used to completely describe a thermal management
+  system in devicetree:
+   - thermal-sensor: device that measures temperature, has SoC-specific bindings
+   - cooling-device: device used to dissipate heat either passively or actively
+   - thermal-zones: a container of the following node types used to describe all
+     thermal data for the platform
+
+  This binding describes the cooling devices.
+
+  There are essentially two ways to provide control on power dissipation:
+    - Passive cooling: by means of regulating device performance. A typical
+      passive cooling mechanism is a CPU that has dynamic voltage and frequency
+      scaling (DVFS), and uses lower frequencies as cooling states.
+    - Active cooling: by means of activating devices in order to remove the
+      dissipated heat, e.g. regulating fan speeds.
+
+  Any cooling device has a range of cooling states (i.e. different levels of
+  heat dissipation). They also have a way to determine the state of cooling in
+  which the device is. For example, a fan's cooling states correspond to the
+  different fan speeds possible. Cooling states are referred to by single
+  unsigned integers, where larger numbers mean greater heat dissipation. The
+  precise set of cooling states associated with a device should be defined in
+  a particular device's binding.
+
+select: true
+
+properties:
+  "#cooling-cells":
+    description:
+        Must be 2, in order to specify minimum and maximum cooling state used in
+        the cooling-maps reference. The first cell is the minimum cooling state
+        and the second cell is the maximum cooling state requested.
+    const: 2
+
+examples:
+  - |
+    #include <dt-bindings/interrupt-controller/arm-gic.h>
+    #include <dt-bindings/thermal/thermal.h>
+
+    // Example 1: Cpufreq cooling device on CPU0
+    cpus {
+            #address-cells = <2>;
+            #size-cells = <0>;
+
+            CPU0: cpu@0 {
+                    device_type = "cpu";
+                    compatible = "qcom,kryo385";
+                    reg = <0x0 0x0>;
+                    enable-method = "psci";
+                    cpu-idle-states = <&LITTLE_CPU_SLEEP_0
+                                       &LITTLE_CPU_SLEEP_1
+                                       &CLUSTER_SLEEP_0>;
+                    capacity-dmips-mhz = <607>;
+                    dynamic-power-coefficient = <100>;
+                    qcom,freq-domain = <&cpufreq_hw 0>;
+                    #cooling-cells = <2>;
+                    next-level-cache = <&L2_0>;
+                    L2_0: l2-cache {
+                            compatible = "cache";
+                            next-level-cache = <&L3_0>;
+                            L3_0: l3-cache {
+                                    compatible = "cache";
+                            };
+                    };
+          };
+
+          /* ... */
+
+    };
+
+    /* ... */
+
+    thermal-zones {
+            cpu0-thermal {
+                    polling-delay-passive = <250>;
+                    polling-delay = <1000>;
+
+                    thermal-sensors = <&tsens0 1>;
+
+                    trips {
+                            cpu0_alert0: trip-point0 {
+                                    temperature = <90000>;
+                                    hysteresis = <2000>;
+                                    type = "passive";
+                            };
+                    };
+
+                    cooling-maps {
+                            map0 {
+                                    trip = <&cpu0_alert0>;
+                                    /* Corresponds to 1000MHz in OPP table */
+                                    cooling-device = <&CPU0 5 5>;
+                            };
+                    };
+            };
+
+            /* ... */
+    };
+...
diff --git a/Documentation/devicetree/bindings/thermal/thermal-idle.yaml b/Documentation/devicetree/bindings/thermal/thermal-idle.yaml
new file mode 100644
index 000000000000..7a922f540934
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/thermal-idle.yaml
@@ -0,0 +1,145 @@
+# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
+# Copyright 2020 Linaro Ltd.
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/thermal-idle.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: Thermal idle cooling device binding
+
+maintainers:
+  - Daniel Lezcano <daniel.lezcano@linaro.org>
+
+description: |
+  The thermal idle cooling device allows the system to passively
+  mitigate the temperature on the device by injecting idle cycles,
+  forcing it to cool down.
+
+  This binding describes the thermal idle node.
+
+properties:
+   $nodename:
+     const: thermal-idle
+     description: |
+        A thermal-idle node describes the idle cooling device properties to
+        cool down efficiently the attached thermal zone.
+
+   '#cooling-cells':
+      const: 2
+      description: |
+         Must be 2, in order to specify minimum and maximum cooling state used in
+         the cooling-maps reference. The first cell is the minimum cooling state
+         and the second cell is the maximum cooling state requested.
+
+   duration-us:
+      description: |
+         The idle duration in microsecond the device should cool down.
+
+   exit-latency-us:
+      description: |
+         The exit latency constraint in microsecond for the injected
+         idle state for the device. It is the latency constraint to
+         apply when selecting an idle state from among all the present
+         ones.
+
+required:
+  - '#cooling-cells'
+
+examples:
+  - |
+    #include <dt-bindings/thermal/thermal.h>
+
+    // Example: Combining idle cooling device on big CPUs with cpufreq cooling device
+    cpus {
+            #address-cells = <2>;
+            #size-cells = <0>;
+
+            /* ... */
+
+                 cpu_b0: cpu@100 {
+                         device_type = "cpu";
+                         compatible = "arm,cortex-a72";
+                         reg = <0x0 0x100>;
+                         enable-method = "psci";
+                         capacity-dmips-mhz = <1024>;
+                         dynamic-power-coefficient = <436>;
+                         #cooling-cells = <2>; /* min followed by max */
+                         cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>;
+                         thermal-idle {
+                                 #cooling-cells = <2>;
+                                 duration-us = <10000>;
+                                 exit-latency-us = <500>;
+                         };
+                };
+
+                cpu_b1: cpu@101 {
+                        device_type = "cpu";
+                        compatible = "arm,cortex-a72";
+                        reg = <0x0 0x101>;
+                        enable-method = "psci";
+                        capacity-dmips-mhz = <1024>;
+                        dynamic-power-coefficient = <436>;
+                        #cooling-cells = <2>; /* min followed by max */
+                        cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>;
+                        thermal-idle {
+                                #cooling-cells = <2>;
+                                duration-us = <10000>;
+                                exit-latency-us = <500>;
+                        };
+                 };
+
+          /* ... */
+
+    };
+
+    /* ... */
+
+    thermal_zones {
+         cpu_thermal: cpu {
+                polling-delay-passive = <100>;
+                polling-delay = <1000>;
+
+                /* ... */
+
+                trips {
+                        cpu_alert0: cpu_alert0 {
+                                    temperature = <65000>;
+                                    hysteresis = <2000>;
+                                    type = "passive";
+                        };
+
+                        cpu_alert1: cpu_alert1 {
+                                    temperature = <70000>;
+                                    hysteresis = <2000>;
+                                    type = "passive";
+                        };
+
+                        cpu_alert2: cpu_alert2 {
+                                    temperature = <75000>;
+                                    hysteresis = <2000>;
+                                    type = "passive";
+                        };
+
+                        cpu_crit: cpu_crit {
+                                    temperature = <95000>;
+                                    hysteresis = <2000>;
+                                    type = "critical";
+                        };
+                };
+
+                cooling-maps {
+                        map0 {
+                             trip = <&cpu_alert1>;
+                             cooling-device = <&{/cpus/cpu@100/thermal-idle} 0 15 >,
+                                              <&{/cpus/cpu@101/thermal-idle} 0 15>;
+                        };
+
+                        map1 {
+                             trip = <&cpu_alert2>;
+                             cooling-device =
+                                        <&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
+                                        <&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
+                       };
+                };
+          };
+    };
diff --git a/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml b/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml
new file mode 100644
index 000000000000..fcd25a0af38c
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml
@@ -0,0 +1,72 @@
+# SPDX-License-Identifier: (GPL-2.0)
+# Copyright 2020 Linaro Ltd.
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/thermal-sensor.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: Thermal sensor binding
+
+maintainers:
+  - Amit Kucheria <amitk@kernel.org>
+
+description: |
+  Thermal management is achieved in devicetree by describing the sensor hardware
+  and the software abstraction of thermal zones required to take appropriate
+  action to mitigate thermal overloads.
+
+  The following node types are used to completely describe a thermal management
+  system in devicetree:
+   - thermal-sensor: device that measures temperature, has SoC-specific bindings
+   - cooling-device: device used to dissipate heat either passively or actively
+   - thermal-zones: a container of the following node types used to describe all
+     thermal data for the platform
+
+  This binding describes the thermal-sensor.
+
+  Thermal sensor devices provide temperature sensing capabilities on thermal
+  zones. Typical devices are I2C ADC converters and bandgaps. Thermal sensor
+  devices may control one or more internal sensors.
+
+properties:
+  "#thermal-sensor-cells":
+    description:
+      Used to uniquely identify a thermal sensor instance within an IC. Will be
+      0 on sensor nodes with only a single sensor and at least 1 on nodes
+      containing several internal sensors.
+    enum: [0, 1]
+
+examples:
+  - |
+    #include <dt-bindings/interrupt-controller/arm-gic.h>
+
+    // Example 1: SDM845 TSENS
+    soc: soc@0 {
+            #address-cells = <2>;
+            #size-cells = <2>;
+
+            /* ... */
+
+            tsens0: thermal-sensor@c263000 {
+                    compatible = "qcom,sdm845-tsens", "qcom,tsens-v2";
+                    reg = <0 0x0c263000 0 0x1ff>, /* TM */
+                          <0 0x0c222000 0 0x1ff>; /* SROT */
+                    #qcom,sensors = <13>;
+                    interrupts = <GIC_SPI 506 IRQ_TYPE_LEVEL_HIGH>,
+                                 <GIC_SPI 508 IRQ_TYPE_LEVEL_HIGH>;
+                    interrupt-names = "uplow", "critical";
+                    #thermal-sensor-cells = <1>;
+            };
+
+            tsens1: thermal-sensor@c265000 {
+                    compatible = "qcom,sdm845-tsens", "qcom,tsens-v2";
+                    reg = <0 0x0c265000 0 0x1ff>, /* TM */
+                          <0 0x0c223000 0 0x1ff>; /* SROT */
+                    #qcom,sensors = <8>;
+                    interrupts = <GIC_SPI 507 IRQ_TYPE_LEVEL_HIGH>,
+                                 <GIC_SPI 509 IRQ_TYPE_LEVEL_HIGH>;
+                    interrupt-names = "uplow", "critical";
+                    #thermal-sensor-cells = <1>;
+            };
+    };
+...
diff --git a/Documentation/devicetree/bindings/thermal/thermal-zones.yaml b/Documentation/devicetree/bindings/thermal/thermal-zones.yaml
new file mode 100644
index 000000000000..b8515d3eeaa2
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/thermal-zones.yaml
@@ -0,0 +1,341 @@
+# SPDX-License-Identifier: (GPL-2.0)
+# Copyright 2020 Linaro Ltd.
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/thermal-zones.yaml#
+$schema: http://devicetree.org/meta-schemas/base.yaml#
+
+title: Thermal zone binding
+
+maintainers:
+  - Amit Kucheria <amitk@kernel.org>
+
+description: |
+  Thermal management is achieved in devicetree by describing the sensor hardware
+  and the software abstraction of cooling devices and thermal zones required to
+  take appropriate action to mitigate thermal overloads.
+
+  The following node types are used to completely describe a thermal management
+  system in devicetree:
+   - thermal-sensor: device that measures temperature, has SoC-specific bindings
+   - cooling-device: device used to dissipate heat either passively or actively
+   - thermal-zones: a container of the following node types used to describe all
+     thermal data for the platform
+
+  This binding describes the thermal-zones.
+
+  The polling-delay properties of a thermal-zone are bound to the maximum dT/dt
+  (temperature derivative over time) in two situations for a thermal zone:
+    1. when passive cooling is activated (polling-delay-passive)
+    2. when the zone just needs to be monitored (polling-delay) or when
+       active cooling is activated.
+
+  The maximum dT/dt is highly bound to hardware power consumption and
+  dissipation capability. The delays should be chosen to account for said
+  max dT/dt, such that a device does not cross several trip boundaries
+  unexpectedly between polls. Choosing the right polling delays shall avoid
+  having the device in temperature ranges that may damage the silicon structures
+  and reduce silicon lifetime.
+
+properties:
+  $nodename:
+    const: thermal-zones
+    description:
+      A /thermal-zones node is required in order to use the thermal framework to
+      manage input from the various thermal zones in the system in order to
+      mitigate thermal overload conditions. It does not represent a real device
+      in the system, but acts as a container to link a thermal sensor device,
+      platform-data regarding temperature thresholds and the mitigation actions
+      to take when the temperature crosses those thresholds.
+
+patternProperties:
+  "^[a-zA-Z][a-zA-Z0-9\\-]{1,12}-thermal$":
+    type: object
+    description:
+      Each thermal zone node contains information about how frequently it
+      must be checked, the sensor responsible for reporting temperature for
+      this zone, one sub-node containing the various trip points for this
+      zone and one sub-node containing all the zone cooling-maps.
+
+    properties:
+      polling-delay:
+        $ref: /schemas/types.yaml#/definitions/uint32
+        description:
+          The maximum number of milliseconds to wait between polls when
+          checking this thermal zone. Setting this to 0 disables the polling
+          timers setup by the thermal framework and assumes that the thermal
+          sensors in this zone support interrupts.
+
+      polling-delay-passive:
+        $ref: /schemas/types.yaml#/definitions/uint32
+        description:
+          The maximum number of milliseconds to wait between polls when
+          checking this thermal zone while doing passive cooling. Setting
+          this to 0 disables the polling timers setup by the thermal
+          framework and assumes that the thermal sensors in this zone
+          support interrupts.
+
+      thermal-sensors:
+        $ref: /schemas/types.yaml#/definitions/phandle-array
+        maxItems: 1
+        description:
+          The thermal sensor phandle and sensor specifier used to monitor this
+          thermal zone.
+
+      coefficients:
+        $ref: /schemas/types.yaml#/definitions/uint32-array
+        description:
+          An array of integers containing the coefficients of a linear equation
+          that binds all the sensors listed in this thermal zone.
+
+          The linear equation used is as follows,
+            z = c0 * x0 + c1 * x1 + ... + c(n-1) * x(n-1) + cn
+          where c0, c1, .., cn are the coefficients.
+
+          Coefficients default to 1 in case this property is not specified. The
+          coefficients are ordered and are matched with sensors by means of the
+          sensor ID. Additional coefficients are interpreted as constant offset.
+
+      sustainable-power:
+        $ref: /schemas/types.yaml#/definitions/uint32
+        description:
+          An estimate of the sustainable power (in mW) that this thermal zone
+          can dissipate at the desired control temperature. For reference, the
+          sustainable power of a 4-inch phone is typically 2000mW, while on a
+          10-inch tablet is around 4500mW.
+
+      trips:
+        type: object
+        description:
+          This node describes a set of points in the temperature domain at
+          which the thermal framework needs to take action. The actions to
+          be taken are defined in another node called cooling-maps.
+
+        patternProperties:
+          "^[a-zA-Z][a-zA-Z0-9\\-_]{0,63}$":
+            type: object
+
+            properties:
+              temperature:
+                $ref: /schemas/types.yaml#/definitions/int32
+                minimum: -273000
+                maximum: 200000
+                description:
+                  An integer expressing the trip temperature in millicelsius.
+
+              hysteresis:
+                $ref: /schemas/types.yaml#/definitions/uint32
+                description:
+                  An unsigned integer expressing the hysteresis delta with
+                  respect to the trip temperature property above, also in
+                  millicelsius. Any cooling action initiated by the framework is
+                  maintained until the temperature falls below
+                  (trip temperature - hysteresis). This potentially prevents a
+                  situation where the trip gets constantly triggered soon after
+                  cooling action is removed.
+
+              type:
+                $ref: /schemas/types.yaml#/definitions/string
+                enum:
+                  - active   # enable active cooling e.g. fans
+                  - passive  # enable passive cooling e.g. throttling cpu
+                  - hot      # send notification to driver
+                  - critical # send notification to driver, trigger shutdown
+                description: |
+                  There are four valid trip types: active, passive, hot,
+                  critical.
+
+                  The critical trip type is used to set the maximum
+                  temperature threshold above which the HW becomes
+                  unstable and underlying firmware might even trigger a
+                  reboot. Hitting the critical threshold triggers a system
+                  shutdown.
+
+                  The hot trip type can be used to send a notification to
+                  the thermal driver (if a .notify callback is registered).
+                  The action to be taken is left to the driver.
+
+                  The passive trip type can be used to slow down HW e.g. run
+                  the CPU, GPU, bus at a lower frequency.
+
+                  The active trip type can be used to control other HW to
+                  help in cooling e.g. fans can be sped up or slowed down
+
+            required:
+              - temperature
+              - hysteresis
+              - type
+            additionalProperties: false
+
+        additionalProperties: false
+
+      cooling-maps:
+        type: object
+        description:
+          This node describes the action to be taken when a thermal zone
+          crosses one of the temperature thresholds described in the trips
+          node. The action takes the form of a mapping relation between a
+          trip and the target cooling device state.
+
+        patternProperties:
+          "^map[-a-zA-Z0-9]*$":
+            type: object
+
+            properties:
+              trip:
+                $ref: /schemas/types.yaml#/definitions/phandle
+                description:
+                  A phandle of a trip point node within this thermal zone.
+
+              cooling-device:
+                $ref: /schemas/types.yaml#/definitions/phandle-array
+                description:
+                  A list of cooling device phandles along with the minimum
+                  and maximum cooling state specifiers for each cooling
+                  device. Using the THERMAL_NO_LIMIT (-1UL) constant in the
+                  cooling-device phandle limit specifier lets the framework
+                  use the minimum and maximum cooling state for that cooling
+                  device automatically.
+
+              contribution:
+                $ref: /schemas/types.yaml#/definitions/uint32
+                minimum: 0
+                maximum: 100
+                description:
+                  The percentage contribution of the cooling devices at the
+                  specific trip temperature referenced in this map
+                  to this thermal zone
+
+            required:
+              - trip
+              - cooling-device
+            additionalProperties: false
+
+    required:
+      - polling-delay
+      - polling-delay-passive
+      - thermal-sensors
+      - trips
+    additionalProperties: false
+
+examples:
+  - |
+    #include <dt-bindings/interrupt-controller/arm-gic.h>
+    #include <dt-bindings/thermal/thermal.h>
+
+    // Example 1: SDM845 TSENS
+    soc: soc@0 {
+            #address-cells = <2>;
+            #size-cells = <2>;
+
+            /* ... */
+
+            tsens0: thermal-sensor@c263000 {
+                    compatible = "qcom,sdm845-tsens", "qcom,tsens-v2";
+                    reg = <0 0x0c263000 0 0x1ff>, /* TM */
+                          <0 0x0c222000 0 0x1ff>; /* SROT */
+                    #qcom,sensors = <13>;
+                    interrupts = <GIC_SPI 506 IRQ_TYPE_LEVEL_HIGH>,
+                                 <GIC_SPI 508 IRQ_TYPE_LEVEL_HIGH>;
+                    interrupt-names = "uplow", "critical";
+                    #thermal-sensor-cells = <1>;
+            };
+
+            tsens1: thermal-sensor@c265000 {
+                    compatible = "qcom,sdm845-tsens", "qcom,tsens-v2";
+                    reg = <0 0x0c265000 0 0x1ff>, /* TM */
+                          <0 0x0c223000 0 0x1ff>; /* SROT */
+                    #qcom,sensors = <8>;
+                    interrupts = <GIC_SPI 507 IRQ_TYPE_LEVEL_HIGH>,
+                                 <GIC_SPI 509 IRQ_TYPE_LEVEL_HIGH>;
+                    interrupt-names = "uplow", "critical";
+                    #thermal-sensor-cells = <1>;
+            };
+    };
+
+    /* ... */
+
+    thermal-zones {
+            cpu0-thermal {
+                    polling-delay-passive = <250>;
+                    polling-delay = <1000>;
+
+                    thermal-sensors = <&tsens0 1>;
+
+                    trips {
+                            cpu0_alert0: trip-point0 {
+                                    temperature = <90000>;
+                                    hysteresis = <2000>;
+                                    type = "passive";
+                            };
+
+                            cpu0_alert1: trip-point1 {
+                                    temperature = <95000>;
+                                    hysteresis = <2000>;
+                                    type = "passive";
+                            };
+
+                            cpu0_crit: cpu_crit {
+                                    temperature = <110000>;
+                                    hysteresis = <1000>;
+                                    type = "critical";
+                            };
+                    };
+
+                    cooling-maps {
+                            map0 {
+                                    trip = <&cpu0_alert0>;
+                                    /* Corresponds to 1400MHz in OPP table */
+                                    cooling-device = <&CPU0 3 3>, <&CPU1 3 3>,
+                                                     <&CPU2 3 3>, <&CPU3 3 3>;
+                            };
+
+                            map1 {
+                                    trip = <&cpu0_alert1>;
+                                    /* Corresponds to 1000MHz in OPP table */
+                                    cooling-device = <&CPU0 5 5>, <&CPU1 5 5>,
+                                                     <&CPU2 5 5>, <&CPU3 5 5>;
+                            };
+                    };
+            };
+
+            /* ... */
+
+            cluster0-thermal {
+                    polling-delay-passive = <250>;
+                    polling-delay = <1000>;
+
+                    thermal-sensors = <&tsens0 5>;
+
+                    trips {
+                            cluster0_alert0: trip-point0 {
+                                    temperature = <90000>;
+                                    hysteresis = <2000>;
+                                    type = "hot";
+                            };
+                            cluster0_crit: cluster0_crit {
+                                    temperature = <110000>;
+                                    hysteresis = <2000>;
+                                    type = "critical";
+                            };
+                    };
+            };
+
+            /* ... */
+
+            gpu-top-thermal {
+                    polling-delay-passive = <250>;
+                    polling-delay = <1000>;
+
+                    thermal-sensors = <&tsens0 11>;
+
+                    trips {
+                            gpu1_alert0: trip-point0 {
+                                    temperature = <90000>;
+                                    hysteresis = <2000>;
+                                    type = "hot";
+                            };
+                    };
+            };
+    };
+...
diff --git a/Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml b/Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml
new file mode 100644
index 000000000000..25b9209c2e5d
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml
@@ -0,0 +1,56 @@
+# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/ti,am654-thermal.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: Texas Instruments AM654 VTM (DTS) binding
+
+maintainers:
+  - Keerthy <j-keerthy@ti.com>
+
+properties:
+  compatible:
+    const: ti,am654-vtm
+
+  reg:
+    maxItems: 1
+
+  power-domains:
+    maxItems: 1
+
+  "#thermal-sensor-cells":
+    const: 1
+
+required:
+  - compatible
+  - reg
+  - power-domains
+  - "#thermal-sensor-cells"
+
+additionalProperties: false
+
+examples:
+  - |
+    #include <dt-bindings/soc/ti,sci_pm_domain.h>
+    vtm: thermal@42050000 {
+        compatible = "ti,am654-vtm";
+        reg = <0x0 0x42050000 0x0 0x25c>;
+        power-domains = <&k3_pds 80 TI_SCI_PD_EXCLUSIVE>;
+        #thermal-sensor-cells = <1>;
+    };
+
+    mpu0_thermal: mpu0_thermal {
+        polling-delay-passive = <250>; /* milliseconds */
+        polling-delay = <500>; /* milliseconds */
+        thermal-sensors = <&vtm0 0>;
+
+        trips {
+                mpu0_crit: mpu0_crit {
+                        temperature = <125000>; /* milliCelsius */
+                        hysteresis = <2000>; /* milliCelsius */
+                        type = "critical";
+                };
+        };
+    };
+...